Method and apparatus to change solder pad size using a differential pad plating
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United States of America Patent
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Feb 22, 2011
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N/A
app pub date -
Jun 1, 2007
filing date -
Jun 1, 2007
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Expired
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Abstract
A method of manufacturing an interposer is provided, including the steps of providing a sheet with a copper layer and polyimide layer, laser drilling holes in the polyimide layer down to the copper layer, filling the holes with copper and extending the copper above the polyimide layer to define caps, removing portions of the copper layer to form conductive pads, and filling gaps between the conductive pads with an insulator, wherein individual conductive pads are in electrical contact with corresponding individual caps.
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