Wide-dispersal package and cap assembly
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United States of America Patent
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Feb 22, 2011
Grant Date -
Dec 7, 2006
app pub date -
May 5, 2006
filing date -
May 7, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wide-dispersal package cap includes a rim and a domed portion formed within the rim and mounted thereto. The domed portion includes a plurality of orifices each having an internal opening and an external opening relative to a thickness of the domed portion. The orifices are formed spaced apart from one another through the domed portion at an angle, such that the external opening of a particular orifice is off-set from the corresponding internal opening, to thereby enhance wide-dispersal of contents of a package to which the cap is attached.
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