Apparatus for assembling semiconductor chip module
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United States of America Patent
Stats
-
Feb 22, 2011
Grant Date -
Dec 27, 2007
app pub date -
May 25, 2007
filing date -
Jun 21, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An assembling apparatus is disclosed. The assembling apparatus includes a base, an assembling platform, and a driving part. The assembling platform and the driving part are fixed on the base. The assembling platform defines a receiving space for receiving a semiconductor chip module, a lever chamber for receiving clips of the semiconductor chip module, and a driving groove for connecting the receiving space and the lever chamber. The assembling platform further includes a lever bar removably placed in the lever chamber for expanding the clips. The driving part includes driving shafts. An end of each of the driving shafts is in the driving groove and is movable to pass through the lever chamber and reaches the receiving space. The assembling apparatus is used to assemble a semiconductor chip module conveniently and safely.
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