Aromatic polyamide and epoxy group-containing phenoxy resin

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United States of America Patent

PATENT NO 7888434
APP PUB NO 20090215968A1
SERIAL NO

11915069

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Abstract

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A polyamide resin composition which can improve heat resistance and water absorbency while suppressing the deterioration of processability is provided. Provided is a polyamide resin composition having an aromatic polyamide resin and an epoxy group-containing phenoxy resin having an epoxy group in the molecule of the phenoxy resin, wherein the content of the epoxy group-containing phenoxy resin is 30 to 50% by mass.

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Patent Owner(s)

Patent OwnerAddress
DUPONT SAFETY & CONSTRUCTION INC974 CENTRE ROAD WILMINGTON DE 19805

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anderson, David Wayne Richmond, US 10 46
Imai, Masanori Sakai, JP 24 321
Kihara, Yasuyuki Sakai, JP 7 15
Naruse, Shinji Tokyo, JP 24 168
Takahashi, Yoshiki Sakai, JP 39 204
Takayama, Hidenori Sakai, JP 3 22
Tanaka, Yasunori Tokyo, JP 95 1235

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