Method and apparatus for manufacturing semiconductor device
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United States of America Patent
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Feb 15, 2011
Grant Date -
Jan 1, 2009
app pub date -
Nov 7, 2007
filing date -
Jun 29, 2007
priority date (Note) -
Expired
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Abstract
A method and apparatus for manufacturing a semiconductor device is disclosed. In particular, the application discloses a method that performs a lithography process using a material capable of increasing a depth of focus so as to prevent efficiency of the lithography process from being degraded due to high integration of a semiconductor device, and a pressure-type bake oven as an apparatus for forming a high refractive material on a semiconductor substrate, having advantages of reducing manufacturing costs of a semiconductor manufacturing process and increasing efficiency of the lithography process.
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