IC carrie, IC socket and method for testing IC device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Feb 8, 2011
Issued Date -
N/A
app pub date -
Mar 11, 2005
filing date -
Mar 11, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An IC device (10) held on an IC carrier (24) is a double-sided electrode type BGA IC device (10) provided with bump electrodes (14) on a first surface of a package. The IC device has, on a second surface opposite the first surface, (a) a central protrusion (30), (b) a peripheral portion (32) lower than the protrusion by one step, and (c) upper electrodes (18) formed on the peripheral portion of the IC device. The IC carrier is provided with a frame (36), a cover (40), and a holding means (42). The frame forms a device reception space (38) for receiving the IC device. The cover can cover the upper electrodes while in contact with the periphery of the IC device held on the IC carrier. The holding means can hold the IC device on the IC carrier with the cover covering the upper electrodes of the IC device. The IC device can be set in an IC socket while being mounted on the IC carrier.
First Claim
Other Claims data not available
Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| WO | A1 | WO2006097973 | Mar 11, 2005 |
| KR | B1 | KR101117789 | Mar 11, 2005 |
| JP | B2 | JP4472748 | Mar 11, 2005 |
International Classification(s)
- 2005 Application Filing Year
- G01R Class
- 3208 Applications Filed
- 1809 Patents Issued To-Date
- 56.40 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 7 Citation Count
- G01R Class
- 3.90 % this patent is cited more than
- 14 Age
