Semiconductor device and method of manufacturing semiconductor device
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United States of America Patent
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Feb 1, 2011
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N/A
app pub date -
Oct 30, 2006
filing date -
Nov 22, 2005
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Abstract
A semiconductor device is provided in which the heat dissipation characteristic of a flip-chip mounted semiconductor chip is improved. A semiconductor device is provided with a substrate, a semiconductor flip-chip mounted on the substrate, a sealing resin layer for sealing around the semiconductor flip-chip. A sealing resin layer for sealing the semiconductor chip is formed around the semiconductor chip. In this semiconductor device, the back surface of the semiconductor chip is exposed and is convex with respect to the upper surface of the sealing resin layer.
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