Method and device for heat treatment, especially connection by soldering
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United States of America Patent
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Feb 1, 2011
Grant Date -
Jul 9, 2009
app pub date -
Apr 27, 2007
filing date -
May 29, 2006
priority date (Note) -
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Abstract
The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).
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