Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
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United States of America Patent
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Feb 1, 2011
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N/A
app pub date -
Jul 9, 2004
filing date -
Jul 9, 2004
priority date (Note) -
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Abstract
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.
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