Test handler, method for loading and manufacturing packaged chips, and method for transferring test trays
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United States of America Patent
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Jan 25, 2011
Grant Date -
Jul 2, 2009
app pub date -
Dec 19, 2008
filing date -
Dec 28, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A test handler, a packaged chip loading method, a test tray transferring method, and a packaged chip manufacturing method are provided. The test handler may include a loading unit, a chamber system, an unloading unit, at least one rotating unit and a transferring unit. The loading unit may include a loading buffer disposed to be movable along a moving path formed over a loading position and a loading picker to perform a loading process on the test tray located at the loading position. The chamber system having the packaged chips connected to a hi-fix board and tested. The unloading unit may include an unloading picker to perform an unloading process on the test tray located at an unloading position. The at least one rotating unit may be disposed between the loading unit and the unloading unit to rotate the test tray transferred from the loading unit from a horizontal posture to a vertical posture, and to rotate the test tray transferred from the chamber system from a vertical posture to a horizontal posture. The transferring unit may transfer the test tray.
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