Organic integrated circuit completely encapsulated by multi-layered barrier and included in RFID tag
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United States of America Patent
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Jan 25, 2011
Grant Date -
Feb 12, 2004
app pub date -
Aug 17, 2001
filing date -
Aug 18, 2000
priority date (Note) -
Expired
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Abstract
An electronic circuit having at least one electronic component comprised of an organic material, and arranged between at least two layers forming a barrier, wherein the layers protect the at least one component against an influence of light, air or liquid.
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