Heat dissipating device for LED light-emitting module
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United States of America Patent
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Jan 25, 2011
Grant Date -
Jul 29, 2010
app pub date -
Jul 5, 2007
filing date -
Jul 5, 2007
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Abstract
A heat dissipating device for LED light-emitting module, which embodies: A heat dissipating unit; An LED light-emitting module, in which light emitting diode are connected to a baseplate; A heat dissipating base; The heat dissipating base and the heat dissipating unit are mutually fixedly joined to form an integrated body, and the heat conducting layer is used to uniformly and efficiently transmit heat from the baseplate to the heat dissipating base, whereupon the heat dissipating base then transmits the heat to the heat dissipating unit. Accordingly, the quick and effective direct heat conduction of the heat conducting layer is used to conduct away and dissipate the high temperature produced by the LED, thereby extending serviceable life and improving stability and luminous efficiency of the LED, thus increasing heat dissipation efficiency of the entire LED light-emitting module.
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