Apparatus and method for substrate electroless plating
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United States of America Patent
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Jan 25, 2011
Grant Date -
May 1, 2008
app pub date -
Oct 25, 2006
filing date -
Oct 25, 2006
priority date (Note) -
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Abstract
A body structure has an inner region shape that defines a cavity within the body structure. The cavity within the body structure is designed to hold a fluid. A chuck includes a top that is capable of holding a substrate, and a body portion that has a complementary shape with respect to the inner region shape of the body structure. The complementary shape of the chuck body portion at least partially aligns with the inner region shape that defines the body structure cavity. The chuck body portion is designed to move into the cavity of the body structure and displace the fluid held within the cavity, so as to shift the fluid over the top of the chuck. The body portion of the chuck is also designed to move out of the cavity of the body structure, so as to remove the fluid from over the top of the chuck.
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