Manufacturing method of contact structure
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United States of America Patent
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Jan 18, 2011
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N/A
app pub date -
Feb 10, 2009
filing date -
Jul 28, 2006
priority date (Note) -
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Abstract
A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.
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