Methods of and apparatus for inspecting substrate
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United States of America Patent
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Jan 11, 2011
Grant Date -
Jan 26, 2006
app pub date -
Jul 20, 2005
filing date -
Jul 21, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Inspection apparatus are used to inspect a substrate as solder is printed, components are mounted and the substrate is heated for a soldering process. Images of the substrate are taken both before and after a production process such as the component mounting process and the soldering process and their differences are extracted. Each component on the substrate may be identified by differentiation and binarization processes and setting conditions for windows are determined corresponding to identified components. Windows are set according to determined setting conditions for inspecting the conditions of the substrate by using image data in the set windows and standard inspection data corresponding to component identification data.
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