Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein
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United States of America Patent
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Jan 11, 2011
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N/A
app pub date -
Jul 24, 2007
filing date -
Dec 25, 2003
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Abstract
A semiconductor device includes a base plate, and a semiconductor constituent body formed on the base plate. The semiconductor constituent body has a semiconductor substrate and a plurality of external connecting electrodes formed on the semiconductor substrate. An insulating layer is formed on the base plate around the semiconductor constituent body. A hard sheet is formed on the insulating layer. An interconnection is connected to the external connecting electrodes of the semiconductor constituent body.
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