Pre-treatment process for liberation of metals from waste printed circuit boards using organic solution
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United States of America Patent
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Jan 11, 2011
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app pub date -
Jul 28, 2008
filing date -
Nov 16, 2007
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Abstract
A method for recovering valuable metals contained in printed circuit boards of waste electronic machine, and more particularly, a method for liberating metal and plastic laminated in waste printed circuit boards uses an organic solvent and then separates and recovers the liberated metal components using an electrostatic separation process.
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