Heat transfer surface for electronic cooling
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United States of America Patent
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Jan 4, 2011
Grant Date -
Dec 21, 2006
app pub date -
Jun 6, 2006
filing date -
Jun 7, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A cooling surface for cooling an electronic component, the surface having two sets of fins, each set of fins defining a set of channels, and a number of passageways connecting the sets of channels. The cooling surface can be attached to an electronic component, such as a chip, and refrigerant supplied to at least one of the sets of channels. When the temperature of the electronic component rises, the heat is transferred to the refrigerant in the cooling surface, at least some of which vaporizes to carry heat away from, and facilitate cooling of, the component.
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