Sputtering film forming method, electronic device manufacturing method, and sputtering system
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United States of America Patent
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Dec 28, 2010
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app pub date -
Apr 16, 2008
filing date -
Apr 26, 2007
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Abstract
A sputtering film forming method. which positions a target 4 and 5 at an incline to a surface of a substrate 10 whereupon a film is to be formed, and forms the film upon the surface of the substrate 10 whereupon the film is to be formed in an incline direction while the substrate 10 is rotated about a normal axis, terminates the forming of the film at a predetermined timing from the commencement of the forming of the film, wherein the forming of the film is terminated, when the substrate has rotated by 360 degrees.times.n+180 degrees+.alpha., where n is a natural number, including 0, and -10 degrees<.alpha.<10 degrees.
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