High speed pull test device and method
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United States of America Patent
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Dec 28, 2010
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N/A
app pub date -
Mar 17, 2005
filing date -
Mar 22, 2004
priority date (Note) -
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Abstract
A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces.
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