Photosensitive polymer composition, method of forming relief patterns, and electronic equipment
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United States of America Patent
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Dec 14, 2010
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N/A
app pub date -
Nov 29, 2006
filing date -
May 17, 2002
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Abstract
A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (--NH.sub.2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.
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