Method for aligning die to substrate
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United States of America Patent
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Dec 7, 2010
Grant Date -
Sep 4, 2008
app pub date -
Dec 24, 2007
filing date -
Dec 26, 2006
priority date (Note) -
Expired
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Abstract
A method for aligning a micro-mirror device die having a plurality of micro-mirror devices formed on a semiconductor substrate and fixing the micro-mirror device die on the semiconductor substrate can be provided. The method comprises a first alignment step of aligning a first guide portion of the micro-mirror device die and a second guide portion of the package substrate and a fixing step of fixing the micro-mirror device die on the package substrate in a position aligned by the first alignment step using the first and second guide portions.
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