Multiple row exposed leads for MLP high density packages
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United States of America Patent
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Dec 7, 2010
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N/A
app pub date -
Aug 18, 2006
filing date -
Jun 5, 2006
priority date (Note) -
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Abstract
A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.
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