Method and apparatus for improved chemical mechanical planarization and CMP pad
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 7, 2010
Issued Date -
N/A
app pub date -
Apr 6, 2007
filing date -
Nov 29, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A polishing pad includes a guide plate, a porous slurry distribution layer and a flexible under-layer. Polishing elements are interdigitated with one another through the slurry distribution layer and the guide plate. The polishing elements may be affixed to the compressible under-layer and pass through corresponding holes in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but be translatable in a vertical direction with respect to the guide plate. Optionally, a membrane may be positioned between the guide plate and the slurry distribution layer. The polishing pad may also include wear sensors to assist in determinations of pad wear and end-of-life.
First Claim
Other Claims data not available
