Systems and methods for depositing conductive material into openings in microfeature workpieces
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United States of America Patent
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Dec 7, 2010
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N/A
app pub date -
Aug 30, 2005
filing date -
Aug 30, 2005
priority date (Note) -
Expired
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Abstract
Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot.
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