Molding method and molding apparatus of mold product having thin film at inner surface
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United States of America Patent
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Nov 23, 2010
Grant Date -
Jul 31, 2008
app pub date -
Sep 19, 2007
filing date -
Sep 19, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A molding apparatus is configured by a first, a second sliding die, a first, a second fixed die, and a sliding film forming chamber. The first, the second sliding dies are moved in directions reverse to each other to take a primary molding position, a film forming position and a secondary molding position. The sliding film forming chamber includes a first, a second masking plate and are arranged to be remote from the first, the second fixed dies. Further, the sliding film forming chamber is slid in an up and down direction. The first, the second sliding dies are respectively formed with recess portions and cores, the first, the second fixed dies are respectively formed with cores and recess portions.
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