Material reducing apparatus
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United States of America Patent
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Nov 16, 2010
Grant Date -
Oct 18, 2007
app pub date -
Apr 26, 2007
filing date -
Mar 19, 2004
priority date (Note) -
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Abstract
Described herein is a material reducing apparatus including a bypass arm and a bypass control member for allowing reduction-resistant objects of a material to bypass the apparatus while avoiding interruption of the operation of the apparatus. Other embodiments may be described and claimed.
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