Gold wire for connecting semiconductor chip
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United States of America Patent
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Nov 9, 2010
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N/A
app pub date -
Jan 24, 2006
filing date -
Jan 24, 2005
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Abstract
Gold wire for connecting a semiconductor chip basically containing praseodymium in 0.0004 mass % to 0.02 mass % in range and, considering the bonding characteristics, containing beryllium or aluminum or both in limited ranges and, considering the precipitates formed in the gold wire, further containing auxiliary additive elements of calcium, lanthanum, cerium, neodymium, and samarium in limited ranges.
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