System for resin curing
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United States of America Patent
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Nov 2, 2010
Grant Date -
Jan 8, 2009
app pub date -
Jul 6, 2007
filing date -
Jul 6, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Among other things, there is disclosed a system for curing a resin in a composite structure having one or more interconnected cure volumes, the cure volumes having one or more heatable surface zones. The system comprises a mould comprising a mould base portion adapted to support the composite structure and a mould closure portion adapted to overlie the mould base portion in sealable relation to define a mould chamber containing the composite structure within. The system further comprises a plurality of heating units each selectively positionable about the mould. The heating units transmit heat to the mould by radiation, and the mould heats the one or more surface zones of the cure volumes.
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