Method for packaging a light emitting device including a metal reflection layer and a metal heat dissipation layer
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United States of America Patent
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Oct 19, 2010
Grant Date -
Oct 1, 2009
app pub date -
Nov 12, 2008
filing date -
Mar 27, 2008
priority date (Note) -
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Abstract
A method for packaging a light emitting element includes a step of providing a carrier formed with an anode electrode and a cathode electrode, a step of providing a light emitting object by utilizing a light emitting diode chip having a positive and negative electrodes, a step of directly contacting the carrier and the light emitting diode chip to establish electrical communication among the anode and cathode electrodes and the positive and negative electrodes, and a step of firmly bonding the carrier and the light emitting diode chip by which to simplify assembling procedure and further to reduce manufacturing cost and enhance production efficiency.
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