Method for the production of a hole and device

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United States of America Patent

PATENT NO 7816625
SERIAL NO

10574724

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Abstract

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Previous methods for the production of a hole in a component are very time-consuming and expensive, as special lasers having ultra short laser pulse lengths are used. The inventive method varies laser pulse lengths and ultra short laser pulse lengths are used exclusively in the region which is to be removed, wherein it is possible to have a noticeable influence on through flow and/or out-flow behavior. This, for example, the inner surface of a diffuser of a hole, which can be produced in a precise manner using ultra short laser pulse lengths.

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Patent Owner(s)

Patent OwnerAddress
SIEMENS ENERGY GLOBAL GMBH & CO KGOTTO-HAHN-RING 6 MÜNCHEN 81739

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Beck, Thomas Panketal, DE 139 1687
Bostanjoglo, Georg Berlin, DE 38 319

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