Method for the simultaneous double-side grinding of a plurality of semiconductor wafers
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United States of America Patent
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Oct 19, 2010
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Jan 17, 2008
app pub date -
Jul 9, 2007
filing date -
Jul 13, 2006
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Abstract
A method for the simultaneous double-side grinding of a plurality of semiconductor wafers, involves a process wherein each semiconductor wafer lies such that it is freely moveable in a cutout of one of a plurality of carriers caused to rotate by means of a rolling apparatus and is thereby moved on a cycloidal trajectory, wherein the semiconductor wafers are machined in material-removing fashion between two rotating working disks, wherein each working disk comprises a working layer containing bonded abrasive. The method according to the invention makes it possible, by means of specific kinematics, to produce extremely planar semiconductor wafers.
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