Method of making MEMS wafers
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United States of America Patent
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Oct 5, 2010
Grant Date -
Jan 18, 2007
app pub date -
Jun 14, 2006
filing date -
Jun 17, 2005
priority date (Note) -
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Abstract
A wafer level package for a MEMS device is made by bonding a MEMS wafer and a lid wafer together to form a hermetically sealed cavity. One or more vias filled with conductive or semiconductive material is etched one of the wafers to form one or more rods extending through the wafer. The rods provide electrical connection to components within the hermetically sealed cavity.
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