Methods of depositing epitaxial thermoelectric films having reduced crack and/or surface defect densities and related devices

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United States of America Patent

PATENT NO 7804019
APP PUB NO 20080185030A1
SERIAL NO

12024475

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Abstract

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A substrate is provided including a growth surface that is offcut relative to a plane defined by a crystallographic orientation of the substrate at an offcut angle of about 5 degrees to about 45 degrees. A thermoelectric film is epitaxially grown on the growth surface. A crystallographic orientation of the thermoelectric film may be tilted about 5 degrees to about 30 degrees relative to the growth surface. The growth surface of the substrate may also be patterned to define a plurality of mesas protruding therefrom prior to epitaxial growth of the thermoelectric film. Related methods and thermoelectric devices are also discussed.

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Patent Owner(s)

Patent OwnerAddress
TARK THERMAL SOLUTIONS INC629 DAVIS DRIVE SUITE 200 MORRISVILLE NC 27560

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pierce, Jonathan Piscataway, US 6 111
Vaudo, Robert P Cary, US 36 2055

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