Molding material, molded part, and method for manufacturing them
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Sep 28, 2010
Issued Date -
N/A
app pub date -
Jul 24, 2007
filing date -
Aug 14, 2006
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Abstract
A method for manufacturing a molded part with an improved convenience and a high degree of efficiency in molding is provided, the molded part containing a biodegradable resin composite, which has the heat resistance in a wide temperature range and which is provided with the flexibility and the elongation in accordance with the use. A kneaded product of a biodegradable resin component and a cross-linkable monomer is prepared. The biodegradable resin component is cross-linked and ground to prepare a biodegradable resin cross-linking product powder. An impregnant at a temperature of 60° C. or higher, and lower than or equal to the melting point or degradation temperature of the biodegradable resin component is impregnated to prepare a molding material composed of a biodegradable resin composite powder. The molding material is heated to a temperature higher than or equal to the melting point of the biodegradable resin component to mold into pellets.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SUMITOMO ELECTRIC FINE POLYMER INC | SENNAN-GUN OSAKA 590-0458 |
International Classification(s)

- 2007 Application Filing Year
- D01D Class
- 79 Applications Filed
- 51 Patents Issued To-Date
- 64.56 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Kanazawa, Shinichi | Osaka, JP | 19 | 45 |
# of filed Patents : 19 Total Citations : 45 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 2 Citation Count
- D01D Class
- 7.41 % this patent is cited more than
- 15 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
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Jul 17, 2017 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Jun 21, 2017 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Jun 21, 2017 |
Jun 21, 2017 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | |
Jan 27, 2017 | REMI | MAINTENANCE FEE REMINDER MAILED | |
Dec 21, 2012 | FPAY | FEE PAYMENT | year of fee payment: 8 |
Dec 12, 2008 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Dec 07, 2006 | FEPP | FEE PAYMENT PROCEDURE | free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Jun 21, 2005 | I | Issuance | |
Jul 08, 2004 | P | Published | |
Mar 10, 2004 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SELVAMANICKAM, VENKAT;GARDNER, MICHAEL T.;JUDD, RAYMOND D.;AND OTHERS;REEL/FRAME:015070/0112;SIGNING DATES FROM 20040205 TO 20040223 Owner name: SUPERPOWER, INC., NEW YORK |
Mar 04, 2002 | F | Filing | |
Mar 02, 2001 | PD | Priority Date |

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