Microchannels for BioMEMS devices
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United States of America Patent
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Sep 21, 2010
Grant Date -
Dec 4, 2008
app pub date -
Mar 11, 2008
filing date -
Mar 15, 2007
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Abstract
A method is disclosed for making a MEMS device wherein anhydrous HF exposed silicon nitride is used as a temporary adhesion layer allowing the transfer of a layer from a Carrier Wafer to a Device Wafer.
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