Method of controlling film stress in MEMS devices

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Sep 21, 2010
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Jan 29, 2009
app pub date
Jul 27, 2007
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Jul 27, 2007

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Abstract

A structural film, typically of silicon, in MEMS or NEMS devices is fabricated by depositing the film in the presence of a gas other than nitrogen, and preferably argon as the carrier gas.

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Patent Owner	Address
TELEDYNE DIGITAL IMAGING INC	1049 CAMINO DOS RIOS THOUSAND OAKS CA 91360

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C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....

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Inventor Name	Address	# of filed Patents	Total Citations
Fortin, Vincent	Bromont, CA	13	83
Ouellet, Luc	Granby, CA	68	2204

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Method of controlling film stress in MEMS devices

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United States of America Patent

11829646

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PATENT NO	7799376
APP PUB NO	20090029533A1
SERIAL NO	11829646
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 21, 2010	US,7799376,B2 US7799376B2	GRANTED PATENT AS SECOND PUBLICATION
January 29, 2009	US,20090029533,A1 US20090029533A1	FIRST PUBLISHED PATENT APPLICATION

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11829646

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