Plating apparatus
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United States of America Patent
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Sep 21, 2010
Issued Date -
N/A
app pub date -
May 24, 2006
filing date -
Nov 22, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention provides a technology for enabling a diaphragm to be arranged in a more facilitated manner in a plating tank of a plating apparatus having a diaphragm for separating an object to be plated from an anode. The plating apparatus having a plating tank, which plating tank comprising: an opening on which an object to be plated is placed; a solution-supply tube for supplying a plating solution toward the object to be plated; an anode positioned opposed to the object to be plated; and a diaphragm for separating the object to be plated from the anode, wherein an inner wall of the plating tank is provided with a diaphragm-periphery fixing part for fixing a peripheral end of the diaphragm, the solution-supply tube is composed of a dual tube consisting of an inner tube and an outer tube, the inner tube has an inner tube part allowed to pass through a through-hole formed at a center of the diaphragm and a diaphragm through-hole fixing part for fixing the through-hole, and the outer tube has an engaging part for fixing the inner tube with the inner tube part accommodated and further has a tank-fixing part to be fixed in the plating tank.
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