Electronic component packaging
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United States of America Patent
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Sep 7, 2010
Issued Date -
N/A
app pub date -
Jul 21, 2006
filing date -
Jul 22, 2005
priority date (Note) -
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Abstract
The invention relates to a method to seal a cavity, comprising a hole (6), comprising: the deposition on at least part of the cover, or an electrically conductive material (4, 5), the conveyance of part of this material by electro-migration into the hole (6) to form a plug (20).
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