Packaging device and packaging method for hollow cathode type sputtering target

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United States of America Patent

PATENT NO 7788882
APP PUB NO 20070131545A1
SERIAL NO

10575937

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Abstract

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Provided are a packaging device and packaging method of a hollow cathode sputtering target which installs, in the hollow cathode sputtering target, a cover of a size capable of covering a void of the target; provides one or more through-holes to the cover; places a resin bag over them, and performs vacuum suction to the inside of the bag. This packaging device and packaging method of a hollow cathode sputtering target is capable of performing vacuum suction even to the inside of the hollow portion covered with the resin bag.

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Patent Owner(s)

Patent OwnerAddress
JX NIPPON MINING & METALS CORPORATION6-3 OTEMACHI 2-CHOME CHIYODA-KU TOKYO 1008164

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagasawa, Masaru Ibaraki, JP 4 190
Okabe, Takeo Ibaraki, JP 37 308

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