Circuit board apparatus with induced air flow for heat dissipation

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7787247
APP PUB NO 20090147476A1
SERIAL NO

11954063

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion thermally coupled to the heat generating component. The heat sink plate includes a means for forming at least one slot proximate the portion. The fan is adapted to direct airflow cross the portion. The thermal energy generated by the heat generating component is transferred to the fan carrier and ultimately removed from the fan carrier by the airflow. The airflow inducts a secondary airflow drawn through the slot during operation thereby to enhance transfer of the thermal energy from the heat generating component.

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Patent Owner(s)

Patent OwnerAddress
EVGA CORPORATION2900 SATURN STREET #B BREA CA 92821

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Tai-Sheng Fullerton, US 55 121

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