Micromirror array assembly with in-array pillars
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United States of America Patent
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Aug 31, 2010
Grant Date -
Dec 15, 2005
app pub date -
Jun 15, 2004
filing date -
Jun 15, 2004
priority date (Note) -
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Abstract
The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.
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