Heat dissipating silicone grease compositions
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United States of America Patent
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Aug 31, 2010
Grant Date -
Oct 30, 2008
app pub date -
Mar 31, 2008
filing date -
Apr 26, 2007
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Abstract
A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.
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