Hot melt application system
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United States of America Patent
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Aug 31, 2010
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app pub date -
Feb 13, 2008
filing date -
Feb 14, 2007
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Abstract
Hot melt adhesive pellets are melted and pressure pumped in a controlled application pattern on the substrate at the application site. The high frequency power supply, induction heated melting susceptor, pressure pump, and pattern control electronics are all contained in a single unit within adhesive projection distance.
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