Method of controlling the film properties of PECVD-deposited thin films
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United States of America Patent
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Aug 31, 2010
Grant Date -
Nov 17, 2005
app pub date -
Dec 22, 2004
filing date -
Apr 20, 2004
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Abstract
We have discovered methods of controlling a combination of PECVD deposition process parameters during deposition of thin films which provides improved control over surface standing wave effects which affect deposited film thickness uniformity and physical property uniformity. By minimizing surface standing wave effects, the uniformity of film properties across a substrate surface onto which the films have been deposited is improved. In addition, we have developed a gas diffusion plate design which assists in the control of plasma density to be symmetrical or asymmetrical over a substrate surface during film deposition, which also provides improved control over uniformity of deposited film thickness.
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