RTM molding method

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United States of America Patent

PATENT NO 7785525
APP PUB NO 20090051067A1
SERIAL NO

11989133

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Abstract

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Provided is an RTM molding method enabling to yield an FRP molded body formed so as to be increased in the fiber volume content and to thereby be made more excellent in strength and lightweightness. The resin composition is a chain-curing resin composition, and after the initiation of the curing of the resin composition, the highest temperature at the curing head of the resin composition, undergoing chain curing, within 10 seconds after the initiation of the curing is increased to be higher by 50° C. or more than the temperature of the resin composition at after the impregnation and before the curing, and thus, the resin composition is chain-cured with a Vf of 41% or more.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES LTDTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Koichi Nagoya, JP 131 1005
Hayashi, Noriya Nagoya, JP 25 98
Mizuno, Hiroshi Nagoya, JP 282 2941
Ota, Kazuo Nagoya, JP 23 193

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