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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TOWA CORPORATION	5 KAMITOBA KAMICHOSHI-CHO MINAMI-KU KYOTO-SHI KYOTO 6018105 ?6018105
JAPAN FINE CERAMICS CENTER	NAGOYA-SHI AICHI 456-8587

International Classification(s)

• B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kawashima, Naoki	Nagoya, JP	24	122
Kitaoka, Satoshi	Nagoya, JP	44	158
Kuno, Takaki	Kyoto, JP	13	40
Maeda, Keiji	Kyoto, JP	32	211
Noguchi, Yoshinori	Kyoto, JP	18	101
Suda, Seiichi	Nagoya, JP	10	69
Yoshiya, Masato	Nagoya, JP	6	6

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 31, 2010	US,7784764,B2   US7784764B2	GRANTED PATENT AS SECOND PUBLICATION
May 04, 2006	US,20060093693,A1   US20060093693A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7784764

Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material

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