Method of forming a panel constrained layer damper treatment

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United States of America Patent

PATENT NO 7784165
APP PUB NO 20070246296A1
SERIAL NO

11379253

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Abstract

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A method of forming a panel constrained layer damper treatment from a laminate, having a panel and a visco-elastic layer attached thereto, by forming a panel constrained layer damper from the laminate to a predetermined shape is provided. Additionally, the method of the present invention includes attaching the panel constrained layer damper to a substrate to form the panel constrained layer damper treatment. The method may also include subjecting the panel constrained layer damper to heat energy to bond the visco-elastic layer to the substrate. In addition, various methods of attaching the panel constrained layer damper to the substrate are provided.

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Patent Owner(s)

Patent OwnerAddress
MATERIAL SCIENCES CORPORATION2200 EAST PRATT BOULEVARD ELK GROVE VILLAGE IL 60007

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Swanson, Richard Frankfort, US 13 197
Xiao, Hong Farmington Hills, US 120 3000

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