High-frequency dielectric material
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United States of America Patent
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Aug 24, 2010
Grant Date -
May 14, 2009
app pub date -
Apr 16, 2007
filing date -
Apr 17, 2006
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Expired
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Abstract
O: α×(1−β)/6 mole, wherein 0.65≦α≦0.75, 0.09≦β≦0.15, 0.066≦α×β≦0.100, and 0.15≦γ≦0.35; and 1 to 5 parts by weight, based on 100 parts by weight of the composition of main constituent materials, of a sintering aid selected from the group consisting of oxides of copper (Cu), boron (B), lithium (Li), bismuth (Bi), and vanadium (V) and a mixture of two or more of the oxides.
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