Testing and recovery in a multilayer device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7779311
APP PUB NO 20070113126A1
SERIAL NO

11538799

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed are systems and methods of producing electronic devices including an auxiliary circuit mounted on another, underlying, circuit at the wafer level. The auxiliary circuit is electrically connected to the underlying circuit via micro-scale interconnects. The systems are capable of testing the auxiliary circuit and/or interconnects using an interface within the underlying circuit. For example, the auxiliary circuit may be tested although it is mounted such that the interconnects are hidden, i.e., inaccessible for testing purposes after assembly using conventional testing systems and methods.The systems and methods further allow for including excess circuits and/or excess interconnects that can be reconfigured to replace parts of the auxiliary circuit and/or micro-scale interconnects found defective during testing.

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Patent Owner(s)

Patent OwnerAddress
INAPAC TECHNOLOGY INC2290 NORTH FIRST STREET SUITE 201 SAN JOSE CA 95131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ong, Adrian E Pleasanton, US 124 2563

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